ASE SG is equipped with highly advanced tester for wide-range testing capability of System on Chip (SOC), cellular communication devices, long-term evolution 4G LTE chip, smart mobile device processor, computer video processor and chipset, multimedia devices, baseband chip, Ethernet solutions, cable set-up box, HDTV, WIFI technology 802.11 AC, Bluetooth technology, RF ID and power management IC.

Teradyne 24-slot Ultra Flex Protocol Aware
1600 MHz data rate, 1024 Digital I/O, 512M Pattern Memory, 1 SB10G, 1 Microwave Synth LO, 1 Microwave Synth Ref, 2 Microwave Measure, 1 Ultra PAC, 1 DC30, 2 Hex VS, 2 UVI80, 1 Octal core DSP.

Teradyne 12-slot Ultra Flex Protocol Aware
1600 MHz data rate, 256 Digital I/O, 512M Pattern Memory, 1 Microwave Synth LO, 1 Microwave Synth Ref, 2 Microwave Measure, 1 Ultra PAC, 1 UVI80, 1 Octal core DSP.

Advantest V93000 Smart scale Protocol Aware
PS1600 at 1600 MHz data rate, PS9G at 9000 MHz, 1152 Digital I/O, 112 M Pattern Memory, 3 RFF (Source), 2 RFE (Front End), MCE/MCB+ (2 Digitizer and 2 AWG), VI32, 4 CS-DPS.

Teradyne 24-slot Ultra Flex Protocol Aware
1600 MHz data rate, 1024 Digital I/O, 512M Pattern Memory, 1 SB10G, 1 Microwave Synth LO, 1 Microwave Synth Ref, 2 Microwave Measure, 1 Ultra PAC, 1 DC30, 2 Hex VS, 2 UVI80, 1 Octal core DSP.

Teradyne 12-slot Ultra Flex Protocol Aware
1600 MHz data rate, 256 Digital I/O, 512M Pattern Memory, 1 Microwave Synth LO, 1 Microwave Synth Ref, 2 Microwave Measure, 1 Ultra PAC, 1 UVI80, 1 Octal core DSP.

Advantest V93000 Smart scale Protocol Aware
PS1600 at 1600 MHz data rate, PS9G at 9000 MHz, 1152 Digital I/O, 112 M Pattern Memory, 3 RFF (Source), 2 RFE (Front End), MCE/MCB+ (2 Digitizer and 2 AWG), VI32, 4 CS-DPS.

Teradyne 24-slot Ultra Flex RF High Pin Count
800 MHz data rate, 1024 Digital I/O, 256M Pattern Memory, 1 SB6G, 1 Microwave Synth LO, 1 Microwave Synth Ref, 1 Microwave Measure, 1 Giga Dig, 1 Turbo AC, 2 DC30, 2 Hex VS, 1 HDVS, 2 Dual-Processor DSP.

Teradyne 24-slot Ultra Flex RF
1000 MHz data rate, 512 Digital I/O, 256M Pattern Memory, 1 SB6G, 1 Microwave Synth LO, 1 Microwave Synth Ref, 1 Microwave Measure, 1 Turbo AC, 2 DC30, 2 Hex VS, 1 HDVS, 2 Dual-Processor DSP.

Teradyne Integra Flex
200 MHz data rate, 240 Digital I/O, 16M Pattern Memory, RF1, RF2, MOD Source, 1 BBAC, 1 VHFAC, 4 DC30, 2 DSP.

Advantest V93000 Smart scale
PS1600 at 1600 MHz data rate, PS9G at 9000 MHz, 1152 Digital I/O, 112 M Pattern Memory, 3 RFF (Source), 2 RFE (Front End), MCE/MCB+ (2 Digitizer and 2 AWG), VI32, 4 CS-DPS.

Advantest V93000 Pin scale High Pin Count
PS800 at 800 MHz data rate, PS3600 at 3600 MHz, 1024 Digital I/O, 64 M Pattern Memory, 3 RFF (Source), 2 RFE (Front End), 1 MCC, 1 MCB, 4 MS-DPS, 1 CS-DPS.

Advantest V93000 Pin scale RF
PS800 at 800 MHz data rate, PS3600 at 3600 MHz, 512 Digital I/O, 64 M Pattern Memory, 3 RFF (Source), 2 RFE (Front End), 1 MCB, 3 MS-DPS, 1 CS-DPS.

LTX Fusion CX
33/66 MHz Data Rate, 100 Mhz Clock Rate, 56 OVI (Octal Voltage/Current Pins), 32 Digital Pins, configurable up to 128 digital pins, Sun Blade 150, 650 Mhz CPU, 2 channels Standard AWG (Arbitrary Waveform Generator) 14B/25Ms/sec, 2 channels standard DIG (Digitizer) 12B/25Ms/sec. 4 units of R and S Vector Signal Generator, 16 ports RF15B bricks. High Speed option available on SunBlade 2500 CPU.

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Teradyne 24-slot Ultra Flex Baseband
1000 MHz data rate, 512 Digital I/O, 256M Pattern Memory, 2 DC30, 2 Dual-Processor DSP, 1 Giga Dig, 2 Hex VS, 1 Turbo AC, 1 SB6G.

Teradyne Catalyst
400 MHz data rate, 384 Digital I/O, 16 M Pattern Memory, 2 PLFD, 2 PLFS, PMM, TJD, TMS, REFSRC, HF Sampler, 2 VHFDIG, VHFCW, VHF AWG400, VHF AWG1200 / 2400, 8 UB/VI Power Supply, 4 High Current Unit, 48 Analog Pin Unit.

Advantest V93000 Pin scale Baseband
PS800 at 800 MHz data rate, PS3600 at 3600 MHz, 512 Digital I/O, 64 M Pattern Memory, 1 MCC, 1 MCB, 4 MS-DPS, 1 CS-DPS.

HP 93000 Single Dense
600 MHz data rate, 512 Digital I/O, 28 M Pattern Memory, 12 GPDPS, High Speed Digitizer, High Speed AWG, Ultra High Speed AWG, High Speed Sampler, TIA 225.

HP93000
600 MHz data rate, 512 Digital I/O, 28 M Pattern Memory, 12 GPDPS, High Speed Digitizer, High Speed AWG, Ultra High Speed AWG, High Speed Sampler, TIA 225.

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Teradyne J750
100 MHz data rate, 512 Digital I/O, 16M Pattern Memory, 325ps EPA, 1 CTO, 4 DPS.

LTX Fusion MX
64 Digital IO channel, 1 SSBA, 16 OVI, 16 VI16B, 64 VI16, 16 HV Voltage current source.

TEL PRECIO, PRECIO XL
High productivity/Small footprint, High reliability, Better contact/better Yield, Short Lead time, TELPADS -I (Option)

TSK UF3000EX
High through-put, Easy operation, Ultra precision

TSK UF200FL / UF200AL / UF200
4, 6, 8 inches wafer, Real-time Mapping, Hot Chuck (50ºC to 150ºC), Needle polish, Inking Capability

TEL P12-XLn+
6, 8 & 12 inches wafer, Real-time Mapping, Hot Chuck (50ºC to 150ºC), Needle polish, Inking capability, OCR

Epson NS6040/ NS70XX / NS8080 / NS8160W
QFP / BGA / QFN / BCC /CSP packages, Dual Temperature with capability from single to 16 sites
Ionized Air Blower, Color tray, Variable Pitch with Rotator (option)

Hon.Tech HT7045 / HT1025A / HT9040 / HT9080
ATC / QFP / BGA / QFN / BCC /CSP packages, Dual Temperature with capability from single to 8 sites
Ionized Air Blower, Color tray, Variable Pitch with Rotator (option)

Delta Castle LX750
Tray based devices, QFP / BGA / LCC / CSP packages, Tri-Temp (-60ºC to +160ºC), Up to 4 Sites(max) Testing.
*Thermal Kit Capability