1. External Visual Inspection (Check for external package defects)
  2. Failure Verification (Verify / validate test failure)
  3. X-ray Analysis (Check for bonding defects)
  4. CSAM Analysis (Check for any delamination, die crack, package voids, etc.)
  5. Fault Isolation Technique (Isolate or locate the defect)
  6. SEM Inspection (Search for zoom-in defects)
  7. Internal Visual Inspection (Die VI to search for defect)
  8. De-capsulation (Expose the die surface)
  9. Polishing Technique (cross-sectional or parallel polishing to identify the defect)
  10. Elemental EDX Analysis (identify elements present on a certain materials)
  11. Re-balling (For BGA devices that undergone board removal)
  12. Customer Report
  • fault
  • final-test
    1. Temperature wafer sort up to 125C
    2. Multi Site Probing up to 32 Sites
    3. Low K Wafer Probing , 65nm
    4. Bump Probing with Vertical and Membrane Probe card(Eutectic / Pb Free / High Lead bump)
    5. In-line yield monitoring via UTHIP(Running Yield / SBL / S2S / OEE)
    6. Internal probe card maintenance, probe pin replacement
    7. RF Probing via Direct Dock Solution
    8. PAT ( Part Average Test ) – Stack wafer maps analysis
    wafer3_1wafer1_1wafer2_1
    1. Top and Bottom Package Visual Inspectionn / PVI
    2. 2D and 3D Measurement
    3. Add mark (Laser)
    4. Tape and Reel
    5. Auto Bake Oven system
    Machine Model
    STI HEXA
    ICOS T120
    T130
    T220
    IC9450
    MIT TH800Vix
    1. Receiving
    2. Incoming check-Camtek Falcon
    3. Taping-Lintec RAD 3510F/12
    4. Backgrind-Disco DGP 8560 (12”)
    5. Detaping-Teikoku EXR2-1200CSF2-UV-CE(12”)
    6. Wafer Backside Lamination-RAD 3600
    7. Oven tape cure
    8. Laser mark-EO Technics CSM3000
    9. Wafer mount / Frame link-Lintec RAD2500F/12
    10. Laser groove-Disco DFL7161
    11. Wafer saw-Disco DFD6063A
    12. 2D Inspection-Camtek Condor
    13. Tape and reel-STI ISORT MAXX
    14. Packing and labeling
    15. Out-going check
    16. Shipping
    wlcsp
    wlcsp2
    1. ATC capability (25 to 125)
    2. Package range (Testing within ASESG)
    3. Outsource Burn-in Locally-Aehr Oven (Static Burn-in)
    4. Special device requirements-Unique Key ( Flash & OTP Verify)
    5. Software tools ( Under evaluation )Streetwise ™
    6. Support Single, Dual, Quad, Octal capabilities base on different tester platform subject to ASESG availability
    1. Tri –Temp Testing (-50 ◦C to 150 ◦C)
    2. Multi Site Testing : Up to 16 sites
    3. Major package type FCBGA, HSBGA, PoP, aQFN, QFN & TQFP Package size (mm) 3×3 ~ 52.5×52.5
    4. In-house Hardware Repair Labs, Hardware control automation
    5. In-Line Yield Monitoring via UTHIP System-Running Yield/SBL/UPH/Down Time/OEE / S2S
    6. Working knowledge with wide spectrum of hardware sockets (eg: ECT, MJC, Johnstech, Foundpac, IDI, etc)
    7. Total Burn-in Solution via Controlled partnership with Burn-in house
    8. Special device requirements/flows(Unique Key ( KSV, OTP & Security code),E-fusing, Flashing Speed Binning Bench Testing/SLT)
    final-test
    1. ASESG is a qualified suppliers under
      • Approved Contract Manufacturer & Trader ( ACMT )scheme,ie. Oversea customer exempted GST tax
      • Major Exporter Scheme ( MES ) “ to avoid the hassle of reporting imports and exports in GST returns.
      • Approved Tier 3 Strategic Goods Permit to allow multiple export and transshipment of strategic goods and technology under Strategic Goods ( Control ) order
    2. 12,000 sq ft of warehousing spaces
    3. 24×7 FGI break bulk drop shipment operation to worldwide destinations.
    4. Daily inventory and transaction reports access thru B2B or Web Portal
  • wip
  • delivery
    • Reliability

  • reliability1
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