- External Visual Inspection (Check for external package defects)
- Failure Verification (Verify / validate test failure)
- X-ray Analysis (Check for bonding defects)
- CSAM Analysis (Check for any delamination, die crack, package voids, etc.)
- Fault Isolation Technique (Isolate or locate the defect)
- SEM Inspection (Search for zoom-in defects)
- Internal Visual Inspection (Die VI to search for defect)
- De-capsulation (Expose the die surface)
- Polishing Technique (cross-sectional or parallel polishing to identify the defect)
- Elemental EDX Analysis (identify elements present on a certain materials)
- Re-balling (For BGA devices that undergone board removal)
- Customer Report
- Temperature wafer sort from -40 to 130C
- Multi Site Probing up to 32 Sites
- Low K Wafer Probing , 65nm
- Bump Probing with Vertical and Membrane Probe card(Eutectic / Pb Free / High Lead bump)
- In-line yield monitoring via UTHIP(Running Yield / SBL / S2S / OEE)
- Internal probe card maintenance, probe pin replacement
- RF Probing via Direct Dock Solution
- PAT ( Part Average Test ) – Stack wafer maps analysis
- Top and Bottom Package Visual Inspectionn / PVI
- 2D and 3D Measurement
- Add mark (Laser)
- Tape and Reel
- Auto Bake Oven system
Machine |
Model |
STI |
HEXA |
ICOS |
T120 |
T130 |
T220 |
IC9450 |
MIT |
TH800Vix |
- Receiving
- Incoming check-Camtek Falcon
- Taping-Lintec RAD 3510F/12
- Backgrind-Disco DGP 8560 (12”)
- Detaping-Teikoku EXR2-1200CSF2-UV-CE(12”)
- Wafer Backside Lamination-RAD 3600
- Oven tape cure
- Laser mark-EO Technics CSM3000
- Wafer mount / Frame link-Lintec RAD2500F/12
- Laser groove-Disco DFL7161
- Wafer saw-Disco DFD6063A
- 2D Inspection-Camtek Condor
- Tape and reel-STI ISORT MAXX
- Packing and labeling
- Out-going check
- Shipping
- ATC capability (-40 to 130C)
- Package range (Testing within ASESG)
- Outsource Burn-in Locally-Aehr Oven (Static Burn-in)
- Special device requirements-Unique Key ( Flash & OTP Verify)
- Software tools ( Under evaluation )Streetwise ™
- Support Single, Dual, Quad, Octal capabilities base on different tester platform subject to ASESG availability
- Tri –Temp Testing (-50 ◦C to 150 ◦C)
- Multi Site Testing : Up to 16 sites
- Major package type FCBGA, HSBGA, PoP, aQFN, QFN & TQFP Package size (mm) 3×3 ~ 67.5×67.5
- In-house Hardware Repair Labs, Hardware control automation
- In-Line Yield Monitoring via UTHIP System-Running Yield/SBL/UPH/Down Time/OEE / S2S
- Working knowledge with wide spectrum of hardware sockets (eg: ECT, MJC, Johnstech, Foundpac, IDI, etc)
- Total Burn-in Solution via Controlled partnership with Burn-in house
- Special device requirements/flows(Unique Key ( KSV, OTP & Security code),E-fusing, Flashing Speed Binning Bench Testing/SLT)
- ASESG is a qualified suppliers under
- Approved Contract Manufacturer & Trader ( ACMT )scheme,ie. Oversea customer exempted GST tax
- Major Exporter Scheme ( MES ) “ to avoid the hassle of reporting imports and exports in GST returns.
- Approved Tier 3 Strategic Goods Permit to allow multiple export and transshipment of strategic goods and technology under Strategic Goods ( Control ) order
- 12,000 sq ft of warehousing spaces
- 24×7 FGI break bulk drop shipment operation to worldwide destinations.
- Daily inventory and transaction reports access thru B2B or Web Portal