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Wafer Sort Capability

  • 5 to 12 inches Wafers

  • Logic & Mixed Signal Devices
    Probe Pin Count : 300 pins
    Pad Size : 65 um X 65 um (min.)
    Pad Pitch : 55 um (min.)

  • Multi-die Probing

  • Inkless Binning

  • In-Line Yield Monitor
  • In-Process Statistical Bin Limit (SBL)

  • In-Process Probe Mark & Ink Dot Inspection

  • Hot Chuck Probing : < 130 degree Celsius

  • Customized Yield Report and Trend Chart
  
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