Test Platforms | ASE Singapore Pte Ltd

These are five test platforms,such as Handler, Ultraflex, Prober, J750 and V93K.
Please click on the images to read more details about them.

Handler Roadmap

UltraFlex Roadmap

Prober Roadmap

V93K Roadmap

J750 Roadmap

Year	Handler Type	Capabilities
2013	Hontech HT3000	Applicable packages: QFP, QFN, TSOP, BGA, μBGA, CSP Package Sizes: 3×3~55x55mm Dual Temp, Ambient to 130⁰C Up to 6 Sites (Individual) Built-In Ionizers
2013	Chroma 3110	Applicable packages: QFP, QFN, TSOP, BGA, μBGA, CSP Package Sizes: 3×3~55x55mm Tri Temp, -40⁰C to 135⁰C Single Site Built-In Ionizers Active Thermal Control (ATC)
2012	Hontech HT7045	Applicable packages: QFP, TSOP, CSP, WLCSP, BGA, QFN, PLCC, LGA, PGA Package Sizes: 3×3~52.5×52.5mm, 14x20mm (max. for Quad Site) Dual Temp, Ambient to 150⁰C Single to Square 4-Sites (2×2) Built-In Ionizers Electro-Pneumatic Regulator Active Thermal Control (ATC)
2012	Rasco SO2000	Applicable packages: MSOP, SOIC, MLP, MLF, CSP, QFN, uBGA, SO300, QSOP300, SO430 Package Sizes: 1.5×1.5~12x12mm, 51mil~300mil Dual Temp, Ambient to 155⁰C Single to Square 4-Sites (2×2) Tape-and-Reel
2011	Epson NS8160W	Applicable packages: QFP, TSOP, CSP, WLCSP, BGA, QFN, PLCC, LGA, PGA Package Sizes: 3×3~52.5×52.5mm Dual Temp, Ambient to 130⁰C Single to 16-Sites (2×8) Built-In Ionizers Electro-Pneumatic Regulator High-Speed Option
2011	Epson NS8080 8I/O	Applicable packages: QFP, TSOP, CSP, WLCSP, BGA, QFN, PLCC, LGA, PGA Package Sizes: 3×3~52.5×52.5mm, 14x20mm (max. for Quad Site) Dual Temp, Ambient to 130⁰C Single to Square 4-Sites (2×2) Built-In Ionizers Electro-Pneumatic Regulator Automatic Socket Cleaning (Option)
2010	Delta Matrix	Applicable packages: QFP, TSOP, CSP, WLCSP, BGA, QFN, PLCC, LGA, PGA Package Sizes: 3×3~51x51mm Tri Temp, -55⁰C to 155⁰C Single to 16-Sites (2×8) Built-In Ionizers
2009	Epson NS8080 4I/O	Applicable packages: QFP, TSOP, CSP, WLCSP, BGA, QFN, PLCC, LGA, PGA Package Sizes: 3×3~52.5×52.5mm, 14x20mm (max. for Quad Site) Dual Temp, Ambient to 130⁰C Single to Square 4-Sites (2×2) Built-In Ionizers Electro-Pneumatic Regulator Automatic Socket Cleaning (Option)
2009	Epson NS8040
2008	Hontech 9080A
2007	Delta Castle Turbo	Applicable packages: QFP, TSOP, CSP, WLCSP, BGA, QFN, PLCC, LGA, PGA Package Sizes: 5×5~70x70mm Tri Temp, -55⁰C to 155⁰C Single to 9-Sites Built-In Ionizers Electro-Pneumatic Regulator Automatic Socket Cleaning (Option)
2006	Epson NS7080	Applicable packages: QFP, TSOP, CSP, WLCSP, BGA, QFN, PLCC, LGA, PGA Package Sizes: 3×3~52.5×52.5mm, 14x20mm (max. for Quad Site) Dual Temp, Ambient to 130⁰C Single to Square 4-Sites (2×2) Built-In Ionizers Electro-Pneumatic Regulator Automatic Socket Cleaning (Option)
2005	Epson NS7000
2004	Rasco SO1000T	Applicable packages: MSOP, SOIC, MLP, MLF, CSP, QFN, uBGA, SO300, QSOP300, SO430 Package Sizes: 3×3~12x12mm, 150mil~300mil Ambient or Tri Temp, -55⁰C to 155⁰C Single to Square 4-Sites (2×2)
2003	Hontech HT8040 / HT9040	Applicable packages: QFP, BGA, CSP, LGA, QFN, TSOP, PLCC Package Sizes: 3×3~40x40mm, 14x20mm (max. for Quad Site) Dual Temp, Ambient to 130⁰C Single to In-Line 4-Sites (1×4) Built-In Ionizers
2003	Delta Castle LX 7500	Applicable packages: QFP, TSOP, CSP, WLCSP, BGA, QFN, PLCC, LGA, PGA Package Sizes: 5×5~70x70mm Tri Temp, -55⁰C to 155⁰C Single to 9-Sites Built-In Ionizers Electro-Pneumatic Regulator Automatic Socket Cleaning (Option)
2001	Epson NS6040	Applicable packages: QFP, BGA, CSP, LGA, QFN, TSOP, PLCC Package Sizes: 3×3~40x40mm, 14x20mm (max. for Quad Site) Dual Temp, Ambient to 130⁰C Single to In-Line 4-Sites (1×4) Built-In Ionizers

Year	Capabilities	Applications
2014	Serial 10G, UVS256	USB 3.0, DDR4, PCI Express, 4G LTE and Serial ATA
2013	HSD1600, Ultra PAC, Ultra VI80	ARM, 4G LTE, HDMI, Ethernet and Gigabyte
2012	HSD1600, Ultra PAC, Ultra VI80	WIFI, NFC, DDR3 and 4G LTE
2011	HSD1000, Turbo AC, SB6G, UWave12G, DC30	WiFi, Bluetooth, 3G and Telecommunication

Year	Capabilities	Applications
2014	PS9G	4G LTE, USB 3.0 and PCI Express
2013	MBAV8+	4G LTE
2012	VI32	WiFi
2011	Port Scale RF, Source, FE12, MBAV8	WiFi, Ethernet, 3G and Bluetooth

Year	Prober Type	Capabilities
2012	TEL Precio (Direct Dock Solution)	High productivity/Small footprint High reliability Better Contact/Better Yield Short Lead Time TELPADS -I (Option) Auto leveling (Option) Zoom-1 (Option)
2005-2011	TSK UF3000EX	High Throughput The new high performance CPU helps to decrease set up time Easy set up of parameters through new Touch To Go (TTG) function New image processing system enables probe to pad alignment, probe mark inspection and self-diagnostic functions Compliant with 200 mm and 300 mm wafers on one load-port Ultra Precision Probe alignment is conducted at same height as actual probing, thereby minimizing any Z – axis error For ultra high rigidity, UF3000 uses a 4 axes driving mechanism (QPU: Quad Pot Unit) for Z – axis.OTS (Optical Target Scope) enables measurement of the relative position of the cameras with absolute accuracy Total Accuracy within ±2µm
	TSK UF200FL / UF200AL / UF200	4, 6, 8 inches wafer Real-time Mapping Hot Chuck (50ºC to 150ºC) Needle polish Inking Capability
	TEL P12XLN++	Handling Carrier 6″, 8″ Cassette, 12″ FOUP Hot and cold temperature, heat dissipation thermal systems -55OC~150OC A high-accuracy and high-force resistance stage for optimal contact Full automation, capable of handling CIM/FA

Year	Capabilities	Applications
2014	HSD 800, HD CTO	Radio, palm computer and DVD player
2013	HSD 200, HD VIS, HD DPS	Motherboard
2012	HSD 100, CTO,MTO, DPS	Automotive
2011	HSD 100, CTO, MTO, DPS	Automotive

The above are all about test platforms.If you want to read more regarding our capabilities, then you may like to see links : Capabilities

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